ST POLY - CONDUCTIVE POLYMER
[Two Approaches]
1. Original conductive materials/products of Achilles are provided.
2. Parts and packing materials in use can be conducted.
Conductive Processing Technique> ST-Poly Example for use application (Formed Products)
Conductive Processing Technique> ST-Poly Example for use application (Thread, Fiber)
Conductive Processing Technique> ST-Poly Example for use application (Film, Sheets)
[Example for use application by kind]
Film Base Film for Various Processing
Protection Film
Clean Curtain
Film for Spacer
Sheets Vacuum Forming Products
Sheets for Carrier Tape
CRT Filter, Protection Cover, etc.
Document Case, File, Stationery, etc.
Formed Products Transparent Conductive Formed Products
Water Case, Mask Case, Parts Case
Magazine, Tray, Ball Point Pen
Parts FPC
Another various parts that require anti-static measure
Thread For fabric, for glove
Raw thread for conductive paper
Fiber Wes, Static-Dissipating Brush
Jig To make jigs and tools in use conductive
[Example for compatibility with base material]
Material
Name
Compatibility Material
Name
Compatibility
PET PA6
A-PET PA66
PE PES
PS PEEK
PP PEI
POM PI
PC PVC
ABS LCP
PAN Glass
PMMA Metal
[Comparison with another conductivity techniques]
ST-Poly Anti-Static
Agent
Carbon Metal
Conductivity
Transparency
Cleanness
Outgas
Staining Properties
Durability
Temperature Dependency
Durability
ST-Poly" is a breakthrough in conductive material. By coating and compounding evenly on the surface of general-purpose plastic materials (films, sheets and fibers) that use conductive polymers with electrically conjugated systems, it becomes conductive. This differs from formerly used conductive fillers (metal particles, carbon) and interactive materials.
5 features of ST-Poly
1. "Super-thin membrane/transparence" when becoming conductive that is enabled only by conductive polymer
2. Clean and stable conductive performance free from bleed and drop-out
3. Flexibility adjusting to wide range of materials and shapes
4. Superior chemical peculiarity such as low outgas, low ion contamination and silicon free
5. Corresponding to various after-processing such as laminating, printing and adhesion processing